Ever since we began in 1965, we’ve stayed competitive by building our company on the foundation of quality, security and loyalty.

Capabilities

Multi-Layer Circuits

Heatsink

Blind/Buried Vias

Controlled Impedance

Ohmega Ply Technology

Board Criteria

Panel Size: 18″ x 24″ max.

Thickness: 0.26″ max.

Layers: 38 max.

Line Width Spacing: 0.004″ (inner layers) 0.005″ (outer layers)

Drilled Hole Size: 0.008″ min.

Inner Layer Core Thickness: 0.004″ min.

Aspect Ratio: 11:1

Surface Mount Pad Pitch: 0.016″

Controlled Impendance: +/- 7.5%

Certifications

MIL-P-55110

MIL-PRF-31032

IPC-6012

ISO 9001:2008

Micom Corporation
475 Old Highway 8 NW
New Brighton, MN 55112

Phone: (651) 636-5616
Fax: (651) 636-1352
Email: Micom@MicomCircuits.com

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