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Micom Corp | Certified Circuit Boards Made in the USA

Welcome

Ever since we began in 1965, we’ve stayed competitive by building our company on the foundation of quality, security and loyalty.

Capabilities

Multi-Layer Circuits

Heatsink

Blind/Buried Vias

Controlled Impedance

Ohmega Ply Technology

Board Criteria

Panel Size: 18″ x 24″ max.

Thickness: 0.26″ max.

Layers: 38 max.

Line Width Spacing: 0.004″ (inner layers) 0.005″ (outer layers)

Drilled Hole Size: 0.008″ min.

Inner Layer Core Thickness: 0.004″ min.

Aspect Ratio: 11:1

Surface Mount Pad Pitch: 0.016″

Controlled Impendance: +/- 7.5%

Certifications

MIL-P-55110

MIL-PRF-31032

IPC-6012

ISO 9001:2008

Micom Corporation
475 Old Highway 8 NW
New Brighton, MN 55112

Phone: (651) 636-5616
Fax: (651) 636-1352


Email: Micom@MicomCircuits.com

Need a quote?